Ahn, Kie et al.

A composition for forming a low dielectric thin film, which includes a silane polymer, polymer nanoparticles, a porogen and an organic solvent, and a method of preparing a low dielectric thin film using the same. The low dielectric thin film prepared using the composition of this disclosure has a low...

Air-gap dielectrics make a return

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Disclosed are: (i) a method for forming an intermetal dielectric layer between metal wirings using a low-k dielectric material, and (ii) a semiconductor device with an intermetal dielectric layer comprising a low-k dielectric material. The method comprises the steps of: (a) forming a metal layer on a semiconductor substrate; (b) forming a plurality of metal wiring patterns by etching the metal layer selectively; (c) forming a first dielectric layer on the substrate and the plurality of metal wiring patterns; (d) forming a low-k dielectric layer on the first dielectric layer, the low-k dielectric layer having a lower dielectric constant than the first dielectric layer; and (e) forming a second dielectric layer on the low-k dielectric layer.

A dielectric ceramic filter with a metal guide can is provided. The dielectric ceramic filter includes a metal guide can coupled to and projecting from both inputoutput ends of the dielectric ceramic filter. Alternatively, the dielectric ceramic filter includes: a dielectric block having a plurality of vertical grooves formed in...

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